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NotesKhan EE6007 Micro Electro Mechanical Systems - Syllabus-Semester VII-Elective-MECH-BE-Anna University MECH SEM VII Syllabus, MECH SYLLABUS

 

 

 

 

 

EE6007                            MICRO  ELECTRO  MECHANICAL  SYSTEMS                            L  T  P  C

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OBJECTIVES

  • To provide knowledge of semiconductors and solid mechanics to fabricate MEMS devices.
  • To educate on the rudiments of Micro fabrication techniques.
  • To introduce various sensors and actuators
  • To introduce different materials used for MEMS
  • To educate on the applications of MEMS to disciplines beyond Electrical and Mechanical engineering.

 

 

UNIT I             INTRODUCTION                                                                                                            9

Intrinsic Characteristics of MEMS – Energy Domains and Transducers- Sensors and Actuators – Introduction to Micro fabrication - Silicon based MEMS processes – New Materials – Review of Electrical and Mechanical concepts in MEMS – Semiconductor devices – Stress and strain analysis – Flexural beam bending- Torsional deflection.

 

UNIT II            SENSORS AND ACTUATORS-I                                                                                    9

Electrostatic sensors – Parallel plate capacitors – Applications – Interdigitated Finger capacitor – Comb drive devices – Micro Grippers – Micro Motors - Thermal Sensing and Actuation – Thermal expansion – Thermal couples – Thermal resistors – Thermal Bimorph - Applications – Magnetic Actuators – Micromagnetic components – Case studies of MEMS in magnetic actuators- Actuation using Shape Memory Alloys

 

UNIT III           SENSORS AND ACTUATORS-II                                                                                   9

Piezoresistive sensors – Piezoresistive sensor materials - Stress analysis of mechanical elements – Applications to Inertia, Pressure, Tactile and Flow sensors – Piezoelectric sensors and actuators – piezoelectric effects – piezoelectric materials – Applications to Inertia , Acoustic, Tactile and Flow sensors.

 

UNIT IV          MICROMACHINING                                                                                                        9

Silicon Anisotropic Etching – Anisotrophic Wet Etching – Dry Etching of Silicon – Plasma Etching – Deep Reaction Ion Etching (DRIE) – Isotropic Wet Etching – Gas Phase Etchants – Case studies - Basic surface micro machining processes – Structural and Sacrificial Materials – Acceleration of sacrificial Etch – Striction and Antistriction methods – LIGA Process - Assembly of 3D MEMS – Foundry process.

 

UNIT V           POLYMER AND OPTICAL MEMS                                                                                 9

Polymers in MEMS– Polimide - SU-8 - Liquid Crystal Polymer (LCP) – PDMS – PMMA – Parylene – Fluorocarbon - Application to Acceleration, Pressure, Flow and Tactile sensors- Optical MEMS – Lenses and Mirrors – Actuators for Active Optical MEMS.

 

 

OUTCOMES

 

TOTAL : 45 PERIODS

 

  • Ability to understand and apply basic science, circuit theory, Electro-magnetic field theory control theory and apply them to electrical engineering problems.
  • Ability to understand and analyse, linear and digital electronic  circuits.

 

TEXT BOOKS:

  1. Chang Liu, "Foundations of MEMS", Pearson Education Inc., 2006.
  2. Stephen D Senturia, "Microsystem Design", Springer Publication, 2000.
  3. Tai Ran Hsu, “MEMS & Micro systems Design and Manufacture” Tata McGraw Hill, New

Delhi, 2002.

 

REFERENCES:

  1. Nadim Maluf,“ An Introduction to Micro Electro Mechanical System Design”, Artech House,

2000.

  1. Mohamed Gad-el-Hak, editor, “ The MEMS Handbook”, CRC press Baco Raton, 2000
  2. Julian w. Gardner, Vijay K. Varadan, Osama O. Awadelkarim, "Micro Sensors MEMS and

Smart Devices", John Wiley & Son LTD,2002

  1. James J.Allen, "Micro Electro Mechanical System Design", CRC Press Publisher, 2010
  2. Thomas M.Adams and Richard A.Layton, “Introduction MEMS, Fabrication and Application,” Springer 2012.

 

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